At KOCH Pac-Systeme in “Pfalzgrafenweiler – Germany”, preparations are in full swing and everyone is buzzing with energy to put the final touches in place for KOCHlive –the first completely virtual trade show on June 16 and 17, 2020.

A new Dimension in Packaging
This is the slogan KOCH is using to invite customers around the world to visit its company showroom. For this is where the specialist for custom packaging solutions will be showcasing its innovations in machinery and services in a whole new way –and with a personal touch. For Marketing Head Jörg Schebetka, creating this personal touch was pivotal: “Close collaboration with our customers is the essence of our daily work. And that is precisely what we aim to achieve at KOCHlive as well”.

“Personal” also describes how the event begins – with a warm “welcome” by KOCH Director Global Sales Hartmut Diehl. Visitors can then proceed to the showroom and choose whatever they wish to see: Perhaps a look at KOCH’s entire portfolio to start with? Or maybe eco-friendly packaging formats like the cyclePac® mono-material packaging, blisters made from sustainable film or formable paper, and customized, productive machine solutions?  Are they particularly interested in the next generation of medplus machines? Or wish to know exactly what innovations “C” refers to with respect to the new blister machine KBS-C medplus? Or keen to learn more about the new K 4.0 smartpacks with their perfectly combined, digital services?

Films, experts, video chats: the full program
No matter where the discovery trip starts or ends, at the machine stations every guest can watch a live demonstration and track the packaging process step by step. Specialist videos provide in-depth information and a touch table permits interactive access to the new K 4.0 smartpacks. To round off the event, guests can download a Facts & Figures package. There are also some 20 sales professionals on call. If their status is “green” for available, the guest can directly engage in “tech talk” with them by video chat.